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鎧俠（KIOXIA）SLC NAND閃存存儲(chǔ)器
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鎧俠（KIOXIA）的SLC（單層存儲(chǔ)單元） NAND閃存存儲(chǔ)器, 具有多種容量和封裝形式可供選擇，可滿(mǎn)足嵌入式市場(chǎng)的不同需求。它提供兩種接口選項(xiàng)（8位并行接口和4位SPI串行接口），客戶(hù)能夠根據(jù)主機(jī)控制器的糾錯(cuò)能力和存儲(chǔ)器接口，選擇合適的SLC NAND閃存。它的高速寫(xiě)入大量數(shù)據(jù)，以及高的擦寫(xiě)次數(shù)，使其具有耐久性和可靠性的特征，非常適用于對(duì)可靠性和壽命要求非常高的消費(fèi)類(lèi)電子產(chǎn)品和工業(yè)設(shè)備的應(yīng)用。
 
示意圖
 
特性
SLC NAND BENANDTM Serial Interface NAND
采用并行接口
24nm SLC NAND處理技術(shù)
供電電壓1.8V和3.3V
可提供多種密度：
– 1Gbit, 2Gbit, 4Gbit, 8Gbit, 16Gbit
可提供的封裝：
– 48TSOP (12 x 20 mm)
– 63BGA (9 x 11 mm)
– 67BGA (6.5 x 8 mm)
– 132BGA (12 x 18 mm)
采用并行接口
嵌入ECC引擎
24nm SLC NAND處理技術(shù)
供電電壓1.8V和3.3V
接口、功能和命令兼容SLC NAND
可提供多種密度：
– 1Gbit, 2Gbit, 4Gbit, 8Gbit
可提供的封裝：
– 48TSOP (12 x 20 mm)
– 63BGA (9 x 11 mm)
– 67BGA (6.5 x 8 mm)
支持Mode 0和Mode 3串行SPI接口
嵌入ECC引擎
24nm SLC NAND處理技術(shù)
供電電壓1.8V和3.3V
可提供多種密度：
– 1Gbit, 2Gbit, 4Gbit, 8Gbit
可提供的封裝：
– WSON8 (6 x 8mm)
 
應(yīng)用領(lǐng)域
數(shù)碼相機(jī)和數(shù)字電視
電視機(jī)頂盒
便攜游藝機(jī)
激光打印機(jī)
監(jiān)控?cái)z像機(jī)
穿戴設(shè)備
 
主要器件
SLC NAND
Part Number Tech.
node
(nm)		 Capacity
(bit)		 VCC
(V)		 Page
size
(bit)		 Block
Size
(bit)		 Operating
Temperature
(°C)		 Package
Name		 Number
of
pins
TC58NVG0S3HBAI4 24 1G 2.7 to 3.6 (2048+128)x8 (128K+8K)x8 -40 to 85 FBGA 63
TC58NVG0S3HBAI6 24 1G 2.7 to 3.6 (2048+128)x8 (128K+8K)x8 -40 to 85 FBGA 67
TC58NVG0S3HTA00 24 1G 2.7 to 3.6 (2048+128)x8 (128K+8K)x8 0 to 70 TSOP 48
TC58NVG0S3HTAI0 24 1G 2.7 to 3.6 (2048+128)x8 (128K+8K)x8 -40 to 85 TSOP 48
TC58NVG1S3HBAI4 24 2G 2.7 to 3.6 (2048+128)x8 (128K+8K)x8 -40 to 85 FBGA 63
TC58NVG1S3HBAI6 24 2G 2.7 to 3.6 (2048+128)x8 (128K+8K)x8 -40 to 85 FBGA 67
TC58NVG1S3HTA00 24 2G 2.7 to 3.6 (2048+128)x8 (128K+8K)x8 0 to 70 TSOP 48
TC58NVG1S3HTAI0 24 2G 2.7 to 3.6 (2048+128)x8 (128K+8K)x8 -40 to 85 TSOP 48
TC58NVG2S0HBAI4 24 4G 2.7 to 3.6 (4096+256)x8 (256K+16K)x8 -40 to 85 FBGA 63
TC58NVG2S0HBAI6 24 4G 2.7 to 3.6 (4096+256)x8 (256K+16K)x8 -40 to 85 FBGA 67
TC58NVG2S0HTA00 24 4G 2.7 to 3.6 (4096+256)x8 (256K+16K)x8 0 to 70 TSOP 48
TC58NVG2S0HTAI0 24 4G 2.7 to 3.6 (4096+256)x8 (256K+16K)x8 -40 to 85 TSOP 48
TC58NYG0S3HBAI4 24 1G 1.70 to 1.95 (2048+128)x8 (128K+8K)x8 -40 to 85 FBGA 63
TC58NYG0S3HBAI6 24 1G 1.70 to 1.95 (2048+128)x8 (128K+8K)x8 -40 to 85 FBGA 67
TC58NYG1S3HBAI4 24 2G 1.70 to 1.95 (2048+128)x8 (128K+8K)x8 -40 to 85 FBGA 63
TC58NYG1S3HBAI6 24 2G 1.70 to 1.95 (2048+128)x8 (128K+8K)x8 -40 to 85 FBGA 67
TC58NYG2S0HBAI4 24 4G 1.70 to 1.95 (4096+256)x8 (256K+16K)x8 -40 to 85 FBGA 63
TC58NYG2S0HBAI6 24 4G 1.70 to 1.95 (4096+256)x8 (256K+16K)x8 -40 to 85 FBGA 67
TH58NVG3S0HBAI4 24 8G(4Gx2) 2.7 to 3.6 (4096+256)x8 (256K+16K)x8 -40 to 85 FBGA 63
TH58NVG3S0HBAI6 24 8G(4Gx2) 2.7 to 3.6 (4096+256)x8 (256K+16K)x8 -40 to 85 FBGA 67
TH58NVG3S0HTA00 24 8G(4Gx2) 2.7 to 3.6 (4096+256)x8 (256K+16K)x8 0 to 70 TSOP 48
TH58NVG3S0HTAI0 24 8G(4Gx2) 2.7 to 3.6 (4096+256)x8 (256K+16K)x8 -40 to 85 TSOP 48
TH58NVG4S0HTA20 24 16G(4Gx4) 2.7 to 3.6 (4096+256)x8 (256K+16K)x8 0 to 70 TSOP 48
TH58NVG4S0HTAK0 24 16G(4Gx4) 2.7 to 3.6 (4096+256)x8 (256K+16K)x8 -40 to 85 TSOP 48
TH58NYG3S0HBAI4 24 8G(4Gx2) 1.70 to 1.95 (4096+256)x8 (256K+16K)x8 -40 to 85 FBGA 63
TH58NYG3S0HBAI6 24 8G(4Gx2) 1.70 to 1.95 (4096+256)x8 (256K+16K)x8 -40 to 85 FBGA 67
 
BENANDTM
Part Number Tech.
node
(nm)		 Capacity
(bit)		 VCC
(V)		 Page
size
(bit)		 Block
Size
(bit)		 Operating
Temperature
(°C)		 Package
Name		 Number
of
pins
TC58BVG0S3HBAI4 24 1G 2.7 to 3.6 (2048+64)x8 (128K+4K)x8 -40 to 85 FBGA 63
TC58BVG0S3HBAI6 24 1G 2.7 to 3.6 (2048+64)x8 (128K+4K)x8 -40 to 85 FBGA 67
TC58BVG0S3HTA00 24 1G 2.7 to 3.6 (2048+64)x8 (128K+4K)x8 0 to 70 TSOP 48
TC58BVG0S3HTAI0 24 1G 2.7 to 3.6 (2048+64)x8 (128K+4K)x8 -40 to 85 TSOP 48
TC58BVG1S3HBAI4 24 2G 2.7 to 3.6 (2048+64)x8 (128K+4K)x8 -40 to 85 FBGA 63
TC58BVG1S3HBAI6 24 2G 2.7 to 3.6 (2048+64)x8 (128K+4K)x8 -40 to 85 FBGA 67
TC58BVG1S3HTA00 24 2G 2.7 to 3.6 (2048+64)x8 (128K+4K)x8 0 to 70 TSOP 48
TC58BVG1S3HTAI0 24 2G 2.7 to 3.6 (2048+64)x8 (128K+4K)x8 -40 to 85 TSOP 48
TC58BVG2S0HBAI4 24 4G 2.7 to 3.6 (4096+128)x8 (256K+8K)x8 -40 to 85 FBGA 63
TC58BVG2S0HBAI6 24 4G 2.7 to 3.6 (4096+128)x8 (256K+8K)x8 -40 to 85 FBGA 67
TC58BVG2S0HTA00 24 4G 2.7 to 3.6 (4096+128)x8 (256K+8K)x8 0 to 70 TSOP 48
TC58BVG2S0HTAI0 24 4G 2.7 to 3.6 (4096+128)x8 (256K+8K)x8 -40 to 85 TSOP 48
TC58BYG0S3HBAI4 24 1G 1.70 to 1.95 (2048+64)x8 (128K+4K)x8 -40 to 85 FBGA 63
TC58BYG0S3HBAI6 24 1G 1.70 to 1.95 (2048+64)x8 (128K+4K)x8 -40 to 85 FBGA 67
TC58BYG1S3HBAI4 24 2G 1.70 to 1.95 (2048+64)x8 (128K+4K)x8 -40 to 85 FBGA 63
TC58BYG1S3HBAI6 24 2G 1.70 to 1.95 (2048+64)x8 (128K+4K)x8 -40 to 85 FBGA 67
TC58BYG2S0HBAI4 24 4G 1.70 to 1.95 (4096+128)x8 (256K+8K)x8 -40 to 85 FBGA 63
TC58BYG2S0HBAI6 24 4G 1.70 to 1.95 (4096+128)x8 (256K+8K)x8 -40 to 85 FBGA 67
TH58BVG3S0HBAI4 24 8G(4Gx2) 2.7 to 3.6 (4096+128)x8 (256K+8K)x8 -40 to 85 FBGA 63
TH58BVG3S0HBAI6 24 8G(4Gx2) 2.7 to 3.6 (4096+128)x8 (256K+8K)x8 -40 to 85 FBGA 67
TH58BVG3S0HTA00 24 8G(4Gx2) 2.7 to 3.6 (4096+128)x8 (256K+8K)x8 0 to 70 TSOP 48
TH58BVG3S0HTAI0 24 8G(4Gx2) 2.7 to 3.6 (4096+128)x8 (256K+8K)x8 -40 to 85 TSOP 48
TH58BYG3S0HBAI4 24 8G(4Gx2) 1.70 to 1.95 (4096+128)x8 (256K+8K)x8 -40 to 85 FBGA 63
TH58BYG3S0HBAI6 24 8G(4Gx2) 1.70 to 1.95 (4096+128)x8 (256K+8K)x8 -40 to 85 FBGA 67
 
Serial Interface NAND
Part Number Tech.
node
(nm)		 Capacity
(bit)		 VCC
(V)		 Page
size
(bit)		 Block
Size
(bit)		 Operating
Temperature
(°C)		 Package
Name		 Number
of
pins
TC58CVG0S3HRAIJ 24 1G 2.7 to 3.6 (2048+64)x8 (128K+4K)x8 -40 to 85 WSON8 8
TC58CVG1S3HRAIJ 24 2G 2.7 to 3.6 (2048+64)x8 (128K+4K)x8 -40 to 85 WSON8 8
TC58CVG2S0HRAIJ 24 4G 2.7 to 3.6 (4096+128)x8 (256K+8K)x8 -40 to 85 WSON8 8
TC58CYG0S3HRAIJ 24 1G 1.70 to 1.95 (2048+64)x8 (128K+4K)x8 -40 to 85 WSON8 8
TC58CYG1S3HRAIJ 24 2G 1.70 to 1.95 (2048+64)x8 (128K+4K)x8 -40 to 85 WSON8 8
TC58CYG2S0HRAIJ 24 4G 1.70 to 1.95 (4096+128)x8 (256K+8K)x8 -40 to 85 WSON8 8
TH58CVG3S0HRAIJ 24 8G(4Gx2) 2.7 to 3.6 (4096+128)x8 (256K+8K)x8 -40 to 85 WSON8 8
TH58CYG3S0HRAIJ 24 8G(4Gx2) 1.70 to 1.95 (4096+128)x8 (256K+8K)x8 -40 to 85 WSON8 8
 
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